Package Health - Senior Manager/Manager, Advanced Packaging Technology Development

Manage engineering teams responsible for package health monitoring and diagnostics. Drive implementation of DFT methodologies and test coverage strategies. Lead simulation studies for mechanical stress, thermal behavior, and electrical performance. Coordinate development of engineering solutions for failure detection and prevention. Collaborate with IT and data science teams to deploy analytics dashboards and models. Support qualification and reliability testing for new packaging technologies. Master's or Bachelor's degree in Electrical Engineering, Materials Science or related field. 7+ years of experience in semiconductor packaging, test, or reliability engineering (complex products preferred). Experience defining test architectures, coverage, and managing test/probe yield. Experience in package simulation and characterization (mechanical, thermal, electrical). Strong knowledge of DRAM or ASIC product testing, test architecture, and packaging fail modes. Strong knowledge of semiconductor packaging process, material interaction and properties. Experience managing technical teams and cross-functional projects. Knowledge of simulation tools and data analytics platforms. Familiarity with AI/ML applications in manufacturing or reliability. Experience with package characterization techniques and standards. Proven problem-solving and multitasking skills. Strong communication and stakeholder management skills.