Pathfinding Program Manager - Leading Industry Pay

Key Responsibilities:

1. Leading complete cycle of pathfinding projects from design, characterization, sample validation and transfer to TD
2. Participate in early package architect definition to meet customer’s new product requirements
3. Providing directions to PF efforts from design, process development and performance characterization
4. Go-to person in the broader team on advanced package development
5. Generating IP’s for the company

Summary

The package PF program manager will be a key team leader of advanced package PF projects to meet industrial future demands. Candidate has a passion of innovation and invention to create solutions and would be key IP contributor.  Previous hands-on experiences in leading cross-functional teams by technical expertise to bring solutions to new products is required. Successful candidate should have experience with innovation incumbent, design, characterization, and volume production for high-performance, high-volume semiconductor advanced packages. Candidate should have experience in designing and implementing new processes and material to enable innovative structures. Leading close collaboration with customers and supply chain ecosystem is required. 

Key Qualifications:

• MS degree in mechanical, electrical or material engineering + 8 years is required
• Prior experience in advanced packaging (2.5D/3D, WLP, FC, SiP)
• Good understanding of chiplet architecture
• Experience in design, simulation (electrical, mechanical and thermal) of advanced package is preferred
• IC package or system product design experience is preferred though not required

Preferred Skills:
Strong communication skills, Proficient English language capability, experience work with global team members of different cultural backgrounds.