Physical Failure Analysis (PFA) Technician

Other qualifications is possible with work experience in microelectronics industries or skillsets in failure analysis field or hands-on expertise in SEM, FIB or TEM analysis. Diploma or ITE qualification in Electronics or Mechatronics, preferably with a specialization in Microelectronics. 3 to 6 years of experience in the semiconductor experience, particularly in Physicial failure analysis (PFA). Either of the experience in 3 options below: Scanning Electron Microscopy (SEM), Focused Ion Beam (FIB), or Transmission Electron Microscopy (TEM). Familiarity with operating polishing, grinding, jet etching, and laser decapsulation equipment. Ability to work safely with chemicals and adhere to laboratory safety protocols. Require to work 12h rotating day/nite shifts or 12h permanent nite shift. You will become a subject matter expert in physical failure analysis and decapsulation methods, tools, and techniques. Performing fault isolation using techniques such as Passive Voltage Contrast (PVC). Conducting physical defect analysis and functional decapsulation of parts for electrical failure testing. Operating equipment such as polishers, grinders, jet etchers, and laser decapsulation tools. Applying relevant analytical techniques to identify electrical failure modes. Understanding the architecture, fabrication processes, device operation, and physics of solid-state memory devices. Ensuring compliance with laboratory policies and safety procedures, including safe handling of chemicals within fume hoods.