Principal Engineer, NAND Advanced Thin Films Process Development

Define and implement the technical strategy for structural and electrical film process development, ensuring alignment with both business and technology objectives. Lead multi-functional teams in the development, integration, and scaling of thin film processes specifically tailored for advanced NAND structures and devices. Oversee the end-to-end development of process modules, with a strong focus on manufacturability, scalability, and readiness for integration. Resolve complex technical challenges that have significant business implications, including root cause analysis and mitigation of process/device failures. Mentor senior engineers and influence the technical direction throughout the organization, fostering a culture of technical excellence and innovation. Represent the function in technical forums and participate in strategic collaborations, including industry consortia, technical conferences, and joint development projects. Deliver solutions that enable and maintain a competitive leadership position in advanced memory technology, including benchmarking against industry standards. Drive technology transfer and ramp-up activities, ensuring seamless transition from R&D to high-volume manufacturing. Identify and evaluate emerging trends, risks, and opportunities in structural and electric film technology, providing recommendations for future investments and critical initiatives. Lead cost reduction, yield improvement, and reliability enhancement programs through innovative process and material utilization. Demonstrated mastery of thin film deposition processes, including Atomic Layer Deposition and Chemical Vapor Deposition, encompassing process design, optimization, and integration for high-density NAND applications. In-depth knowledge of process-device and mechanical interactions, challenges associated with technology/device scaling, and the principles of reliability engineering for next-generation memory nodes. Proven track record of developing and implementing novel chemistries, materials, and hardware solutions, such as chamber design, plasma source optimization, and gas delivery systems. Expertise in advanced characterization techniques, such as X-ray Reflectivity (XRR), ellipsometry, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Secondary Ion Mass Spectrometry (SIMS), and X-ray Photoelectron Spectroscopy (XPS), as well as electrical evaluation methods (including leakage, impedance, capacitance, and breakdown analysis). Strong foundation in thin film process development using plasma and thermal methods, especially for dielectric (including lowK and highK films), carbon-based films, with an ability to analyze structural-process correlations and conduct failure analysis. Experience in benchmarking technology, conducting competitive analyses, and assessing industry trends, with the capability to translate complex data into actionable technology roadmaps and process improvements. Ability to lead cross-disciplinary teams in the development and deployment of new process technologies, including collaboration with integration, device, reliability, and manufacturing engineering groups. Proficiency in statistical process control (SPC), design of experiments (DOE), and data analytics for process optimization and fixing. Experience with regulatory compliance, intellectual property management, and technical documentation in a semiconductor manufacturing environment. PhD or equivalent degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a related field. 5-10 years of experience in Thin Film research and development for NAND process, specifically including CVD and Diffusion Thin Films.