Principal Engineer Process Development, Thin Film (CVD/Diffusion), NAND

Req. ID:\n\nJR100835 Principal Engineer \u2013 Process Development, Thin Film (CVD/Diffusion), NAND (Evergreen)\n\nOur vision is to transform how the world uses information to enrich life for all.\n\nMicron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.\n\nJob / Role Summary\n\nThe Principal Engineer provides technical leadership for NAND Advanced Thin Films, defining technical direction and driving the strategic advancement and integration of sophisticated structural and electrical film processes into manufacturing. Success requires proven leadership in thin film module development, strong cross-functional influence, deep characterization and correlation capability, and strong judgment in technical tradeoffs for manufacturability, scaling, yield, and reliability.\n\nMain Responsibilities \n\n * Define and implement technical strategy for structural and electrical film process development aligned to business and technology objectives. \n\n\n\n\n * Lead multi-functional teams to develop, integrate, and scale thin film processes for advanced NAND structures/devices. \n\n\n\n\n * Oversee end-to-end development of process modules with focus on manufacturability, scalability, and integration readiness. \n\n\n\n\n * Resolve complex technical challenges with significant business implications (root cause analysis, mitigation of process/device failures). \n\n\n\n\n * Drive technology transfer and ramp-up activities to enable transition from R\u0026D to high-volume manufacturing. \n\n\n\n\n * Lead cost reduction, yield improvement, and reliability enhancement programs through innovative process/material utilization. \n\n\n\n\nOther Responsibilities \n\n * Mentor senior engineers and influence technical direction across the organization. \n\n\n\n\n * Represent the function in technical forums and strategic collaborations; benchmark against industry standards. \n\n\n\n\n * Identify emerging trends/risks/opportunities and recommend future investments/critical initiatives. \n\n\n\n\n * Integrates AI assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.\n\n\n\n\n * Contributes to a culture of continuous improvement by identifying, testing, and sharing AI enabled enhancements within one\u2019s scope of work.\n\n\n\n\nCandidate Profile\n\nMinimum Qualifications / Experience\n\n * PhD \u22655 yrs, or Master\u2019s \u22657 yrs, or Bachelor\u2019s \u226510 yrs of relevant experience in \nElectrical Engineering, Materials Science, Chemical Engineering, Physics, or related field,\n\n\n\n\n * With demonstrated experience in Thin Films R\u0026D/PD for NAND including CVD and Diffusion thin films\n\n\n\n\nMust-Have Technical Skills\n\n * Mastery of thin film deposition (ALD/CVD) for high-density NAND applications; process design/optimization/integration. \n\n\n\n\n * Advanced characterization capability (examples cited: XRR, ellipsometry, SEM, TEM, SIMS, XPS) and electrical evaluation methods (leakage/impedance/capacitance/breakdown). \n\n\n\n\n * Proficiency in SPC/DOE/data analytics for optimization and fixing. \n\n\n\n\n * Ability to drive novel chemistries/materials/hardware solutions (e.g., chamber design, plasma source optimization, gas delivery). \n\n\n\n\nMust-Have Soft Skills\n\n * Technical leadership through influence; strong cross-functional and cross-site collaboration. \n\n\n\n\n * Mentorship and clear executive-ready technical communication. \n\n\n\n\nHighly Desirable / Preferred\n\n * Competitive benchmarking / industry trend assessment translating into actionable roadmaps.\n\n\n\n\nEmbody Micron\u2019s core values:\n\n * People \u2013 Respect, develop and empower others\n\n\n\n\n * Innovation \u2013 Drive continuous improvement and breakthrough thinking\n\n\n\n\n * Tenacity \u2013 Show grit and determination\n\n\n\n\n * Collaboration \u2013 Build trust and foster teamwork\n\n\n\n\n * Customer Focus \u2013 Deliver excellence and value\n\n\n\n\nJob Profile(s):\n\nSemiconductor Process Engineer 5\n\nRelocation level: (TBD)\n\nBefore Getting Started \nPlease review Micron\u2019s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that: \n\n * Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.\n * If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.\n\n\n\n\u200b\u200b\u200b\u200b\n\nAs a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc\n\nMicron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.\n