Principal / Senior/ Engineer, Package Characterization - APTD

Conduct Electrical Characterization Understand PFA techniques available for de-processing failures Understand assembly and test process Perform electrical verification to confirm failures Establish best known method for de-processing package Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs Coordinate host vendors to support equipment repair Manage laboratory to comply with TS, ISO14001 and OHSAS requirements. Conduct TMO training and FA certification Serve as technical SME and mentor, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning. Participate actively in technical events such as conferences, workshops and forums to share knowledge and BKM across the network. Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap. PhD, Master's, or Bachelor's degree in Materials Science, Chemical Engineering, Electrical/Electronics Engineering or related discipline. 4+ years of experience in the semiconductor process, preferably in R&D or technology development or failure analysis field, with strong expertise in failure analysis methodologies and techniques. Hands-on proficiency with key analytical tools and methods, including: SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling, delayering, and decapsulation techniques. Strong communication skills with the ability to collaborate effectively across internal teams and external partners. A mindset that emphasizes customer focus, continuous improvement, and striving for excellence.