Principal/Staff Engineer, PCVD Film Deposition, TD

Develop and optimize advanced thin film deposition processes (ALD, LPCVD, PECVD, PVD) for cutting-edge device architectures Design and execute complex DOE experiments to improve process capability, uniformity, and reliability Perform in-depth root-cause analysis using advanced modeling and characterization techniques Collaborate with integration, other process areas, metrology, and equipment engineering teams to solve critical technical challenges Drive innovation in film deposition for improved performance, cost efficiency, and sustainability Utilize advanced data analytics and modeling to predict process behavior and accelerate development cycles Define technology roadmaps and lead strategic research initiatives. Generate intellectual property and influence future deposition technology directions Mentor junior engineers and lead multi-disciplinary technical projects Ph.D / Master's in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related field Master with minimum 8 years or PhD with minimum 5 years hands-on experience in advanced thin film deposition, characterization or related semiconductor field Core Technical: Expertise in ALD, LPCVD, PECVD, and PVD for advanced nodes Strong understanding of film growth mechanisms, surface chemistry, and plasma physics Knowledge of thermodynamics, chemical kinetics, and reaction engineering Ability to develop predictive models for process behavior