Principal/Staff Engineer, Process Integration, NTI NAND

Module Ownership: Lead one or more process modules related to the development and operation of 3D NAND semiconductor coordinated circuits. Specification Definition: Define structural specifications and process requirements for assigned modules. Strategic Direction: Set a clear direction and vision for the module and establish a continual improvement plan. Proactive Issue Resolution: Identify potential structure, electrical, and reliability issues early and address them with process control. Solve problems using a model-based approach. Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control. Optimize manufacturability assessments. Material Innovation: Analyze materials physically and electrically. Collaborate with process groups to select new materials for development and transition them from research to production. Build Experiments: Build and complete device and process experiments. Extract, analyze, report, and draw conclusions on experiments and clarify the statistical significance of the data. Team Leadership: Assemble and coordinate a development team, including process engineers, to drive module development. Decision-Making & Goal Setting: Make key decisions and provide clear direction, goals, and metrics for team success. Innovation & IP Generation: Innovate to address complex problems and consider new options for improving and developing new technologies. Regularly submit patent disclosures. Cross-Functional Coordination: Coordinate activities across cross-functional teams to enable rapid and low-error project progression. Technology Transfer: Support the transfer of new technology from R&D to high-volume manufacturing. Communication & Influence: Present key information and projects, drive decisions, and foster group discussions. Continuous Development: Pursue continual growth in technical and management skills through on-job training and education. Passionate about semiconductor technology and innovation. Adept at data analysis, problem-solving, and process integration optimization. Excellent communication skills and capacity to collaborate within cross-functional teams. Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc., is desirable. Minimum of 5 years of experience in Wafer Fabrication Process Development in Dry Etch, Photolithography, Films, Wet Process, CMP or Process Integration. Strong complete understanding of PI modules on new NAND technologies and related structural & electrical fail mechanisms. In-depth knowledge and direct experience with non-volatile memories (NAND) and understanding of the NAND process flow, interaction of process & device, and common yield & reliability issues. Experience in R&D and technology transfer to manufacturing. Committed to quality, collaboration, and continuous improvement. Self-motivated with a proven ability to work in a fast-paced & dynamic environment. Masters/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science, or a related field, or equivalent experience.