Process Engineer (Pick and Place, Die Fab)

Position Summary:

Responsible for product quality, process optimization, yield improvement and cost down projects. As the Process owner in charge of troubleshooting and failure analysis for related process issues in Die Fab which covers processes ranging from Wafer Back grinding, Laser Scribing and Pick & Place.

What You Will Do:

1. Development, process/product characterization and qualification of Die Fab assigned process for pilot runs and volume ramp within the Singapore Operations.
2. Establishing good process margins and inline controls of these new processes. Creating and updating of process specification and documentation of working procedure.
3. Resolving reliability or yield issues related to the Wafer Backend processes and lead trouble-shooting of defect and yield issues and process excursions associated with the new process/tools.
4. Championing engineering experiments for process characterization.
5. Establish Out-of-control Action System, specifications for procedures to be followed.
6. Any other duties assigned by the manager.

What You Will Bring (REQUIRED Qualifications):

• Experience in Semiconductor manufacturing industry and working in cleanroom environment and 6 Sigma experience.
• Strong analytical and critical thinking skills, with good fundamentals in data analytics and statistical analysis.
• Excellent English verbal and written communication skills
• Good  interpersonal skills with good organizational skills and attention to detail.
• Strong proficiency with Microsoft Office (Excel, PowerPoint, Outlook) and experience in Minitab /JMP would be advantageous.

Education (Minimum Level)

• Bachelor's Degree

Field of Study

Electrical & Electronics, Mechanical Engineering or Materials Engineering 

Years of Experience (Minimum)

• 2 years

Lumileds is an Equal Employment Opportunity Employer