Process/Senior Process Engineer (DIW) - Career Growth Potential

(Depth of Expertise Dictates the Seniority)

• Drive Continuous Improvement Project (CIP) to achieve best in class in yield, quality, and cost.
• Independently manage your own projects to meet Key Performance Indices.
• Set-up SPC for equipment critical parameters monitoring and control and improve process with proper DOE to capability >1.67.
• Write Work Instruction, guideline and training checklist for operation and modules to follow up.
• Transfer, develop and/or release new processes. Characterize and improve existing/new processes through DOE and date driven analysis.
• Able to carry through Change Request Board/ customers for Qualification of new tools/ new recipes developed with proper data analysis. (T-test requirement)
• Drive Process FMEA and risk analysis for existing and new process being qualified.
• Train the module AE and Technician on module processes, SOP and OCAP.
• Identify process simplification opportunities and drive cross functional teams in implementation Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Perform process matching between equipment to reduce variation and analysis / DOE to find factors for better tool matching.
• Represent own Module to attend cross-functional task team to address yield improvement / excursion issues. Follow up with cross-fab benchmarking activities to engage the best-in-campus practices across fabs.
• Provide feedback/training to AEs or Techs on their troubleshooting skills, understanding of processes, decision making, risk assessment.
   

Requirements:

• Candidate must possess Bachelors/Masters/PhD graduates in Materials Science, Microelectronic Engineering, Electronic Engineering, Electrical Engineering, Materials Science, Mechanical Engineering and Physics are welcomed to apply.
• Demonstrated experience in semiconductor foundry module process.
• Minimum 3 years working knowledge and experience in the field of Process Engineering in Metrology/Diffusion/Implanter/RTA/RTP.
• Strong knowledge and experience with FDC, SPC, DOE, FMEA, MES, 8D and statistical analysis software.
• A deep understanding of thickness measurement with different film types from single and multi-stacks.
• Proven leadership skills in leading cross-functional teams and managing projects related to process improvement or technology transfer.
• Strong data analysis and problem-solving skill.