Quality Engineer - High Bandwidth Memory

Define High Bandwidth Memory (HBM) qualification requirements Comprehend failures and failure rate within the scope of the qualification Perform risk assessment at all decision points within the qualification cycle Review qualification data and sign off that qualification requirements have been met Issue internal product release notifications for Qualification Cooperatively develop and establish reliability targets and standards with technology development and product engineering teams Comprehend new wafer fab and packaging technologies to identify and mitigate product reliability issues Develop and improve product reliability tests to assess new HBM failure mechanisms Coordinate and drive vital specification improvements for existing products Review internal quality metric and drive customer DPM to BIC. Establish and review ongoing product Quality Metrics Assess deviations for product quality and reliability risks Data mining and correlation of all inline test data. Root cause finding and drive CA/PA. Define evaluation necessary to mitigate risks Review and support process Excursion Analysis Communicate violations to defined release/acceptance criteria BS or MS in Electrical engineering or related field of study Knowledge of DRAM operation, fabrication process and semiconductor device physics Familiarity with advanced packaging, wafer testing, component testing and module testing concept and flow. Strong troubleshooting skills Good organizational skills and sharp attention to detail Good written and oral communication skills Ability to work independently or in a group environment Knowledge of using statistical like JMP, Familiarity with Unix, DFII/Cadence, and/or ATE (Auto Test Equipment) preferred Familiarity with Perl, C++, Python, HTML, CGI, or Java preferred Product Engineering Product Quality and Reliability Process Integration Product Yield Enhancement