R&D Process Engineer (Etch Packaging)

Design, collect data, analyze and compile reports on a wide range of complex process engineering experiments for multiple products, within safety guidelines Utilize techniques to characterize hardware, define methods and apply new technologies to characterize hardware, and/or perform hardware characterization on a wide range of complex systems for multiple products, within safety guidelines Generate internal and external documentation for products, presentations, technical reports and generate process engineering specifications Develop, plan and execute process engineering projects, within safety guidelines Train engineers in measurement techniques of film properties and guide them in the interpretation of the data, new methodologies, trouble shooting techniques and resolve a wide range of complex process engineering issues/problems for multiple products Interact with customers to resolve a wide range of complex process engineering issues/problems with limited to no supervision Design and implement new technology, products and analytical instrumentation Identify, select and work with vendors and suppliers with limited to no supervision PhD or Master or Bachelor in Materials Science, Chemical Engineering, Chemistry or Physics or related field Research focus in semiconductor would be an added advantage At least 5 years of relevant experiences in semiconductor including Plasma Etch process development field Outstanding communication and interpersonal skills Problem-solver attitude with determination and quality-mindset