R&D Process Engineer (PVD/ TSV)

Design, collect data, analyze, and compile reports on difficult process engineering experiments Perform hardware characterization on a variety of difficult systems Troubleshoot complex problems, perform Root Cause Analysis, and resolve a variety of difficult process engineering issues Measure film properties and interpret data Generate internal documentation for products, presentations, and technical reports Communicate and engage with customers to resolve complex process engineering issues or concerns, under limited supervision Identify, select, and partner with vendors and suppliers Implement new technology, products, and analytical instrumentation Serve as a resource for junior colleagues; lead project teams, as needed Bachelor/ Master/ PhD in engineering or any related field 4-7 years of related experience in semiconductor process especially PVD Understanding or familiarity with Through-Silicon Via (TSV) is preferable Demonstrates conceptual and practical expertise in complex problem solving