Research Associate (High Temperature-Resistant & Miniaturized Payload Hardware Design)

Centre for Advanced Robotics Technology Innovation (CARTIN) are looking for a hardware-focused Research Associate to design and prototype a compact and heat-resistant multi-sensor payload. The system must withstand temperatures of 250°C for 10 minutes (without external cooling) while maintaining internal stability for embedded electronics.

Key Responsibilities:

• Design compact mechanical housing to operate under 250°C ambient conditions.

• Ensure internal core temperature remains under 55°C during runtime.

• Select and integrate miniaturized components (compute, battery, sensors).

• Strip sensor casings and reassemble into a custom mount with thermal shielding.

• Perform heat simulation, thermal insulation, and shock-resistance design.

• Test hardware in specified sites and environments.

Job Requirements:

• Bachelor or Master in Mechanical Engineering, Mechatronics, or similar.

• Strong experience in heat-resistant enclosure design and miniaturized hardware integration.

• Familiar with thermal simulation tools (ANSYS, SolidWorks, etc.).

• Experience with IP65/ IP67 standards, fanless computing, and embedded design.

• Knowledge of fire-fighting robot or harsh-environment robotic platforms is a plus.

Join our team to build a compact and thermally protected SLAM sensor payload for extreme environments. The candidate will design hardware that survives 250°C conditions while maintaining internal electronics <55°C. Experience with high-temp materials, mechanical CAD, and embedded platform integration is essential. Ideal for Mechatronics/Mechanical engineers with strong prototyping skills.

We regret to inform that only shortlisted candidates will be notified.