We are seeking a motivated Wafer-to-Wafer Bonding Engineer to join our multidisciplinary R&D team to support the development of advanced wafer bonding technologies for next-generation semiconductor packaging. This role involves hands-on process development, wafer characterization and close collaboration with cross-functional teams to enable innovative packaging solutions.
Key Responsibilities:
Qualifications
The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.
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