Scientist, Advanced Packaging, IME

Job Description

About the Role

A*STAR Institute of Microelectronics (IME) is seeking a highly motivated Scientist / Senior Scientist to conduct R&D in thermal management, heat dissipation, and advanced cooling technologies for next-generation semiconductor packaging. The successful candidate will develop innovative thermal solutions for heterogeneous integration, AI/HPC packages, chiplets, 2.5D/3D integration, power electronics, and photonics applications.

This role involves adopting advanced thermal/cooling concepts into package technologies through close collaboration with multidisciplinary teams in materials, packaging integration, reliability, simulation, and industry partners. He/she focuses on practical execution of thermal R&D activities, including simulation, testing, data analysis, prototype evaluation, and implementation of innovative thermal solutions for next-generation packages such as AI/HPC, chiplet, 2.5D/3D integration, photonics, and power electronics.

Key Responsibilities

1. Thermal Project Execution: To execute thermal engineering tasks for grant and/or customer-funded R&D projects. To Support project deliverables, timelines, experiments, and reporting. To Perform package thermal assessments and identify hotspot / cooling issues. To Generate technical data, reports, and presentation materials.

2. Thermal Simulation & Analysis: To conduct thermal modelling using tools such as ANSYS Icepak, ANSYS Fluent COMSOL Multiphysics and SIEMENS Flotherm. To perform steady-state and transient thermal simulations, junction temperature prediction and thermal resistance extraction, and thermal design optimization

3. New Cooling Technology Development: To support development and validation of new cooling concepts, including microchannel cooling, vapor chamber integration, immersion cooling and high-performance TIMs. To build prototypes and conduct proof-of-concept testing.

4. Thermal Characterization & Lab Work: To perform laboratory thermal measurements with IR thermography, thermocouple, thermal transient testing and flow / pressure drop testing. To correlate measured data with simulation results.

5. Cross-functional Collaboration: to work with package design, process integration, materials, and reliability teams. To support customer technical discussions and project reviews. To contribute to publications, patents, and technical proposals.

Requirements

• PhD / master’s degree in mechanical engineering, materials science, electrical engineering, microelectronics, thermal sciences and related disciplines.
• 2+ years’ work experience in thermal management for semiconductor packaging preferred.
• Strong background in semiconductor package thermal design, electronics cooling, CFD / thermal modeling, experimental thermal characterization and materials for heat dissipation
• Strong understanding of heat transfer, fluid mechanics, semiconductor packaging flows and AI/HPC package challenges
• Experience in simulation tools and data analytics.
• Familiarity with JEDEC standards is advantageous.
• Strong communication and technical presentation skills.
• Strong industry engagement mindset.
• Collaborative and innovation-driven attitude.