Scientist/Senior Scientist, Advanced Packaging, IME

Job Description

About the Role

A*STAR Institute of Microelectronics (IME) is seeking a highly motivated Scientist / Senior Scientist to conduct R&D in thermal management, heat dissipation, and advanced cooling technologies for next-generation semiconductor packaging. The successful candidate will develop innovative thermal solutions for heterogeneous integration, AI/HPC packages, chiplets, 2.5D/3D integration, power electronics, and photonics applications.

This role involves adopting advanced thermal/cooling concepts into package technologies through close collaboration with multidisciplinary teams in materials, packaging integration, reliability, simulation, and industry partners. He/she focuses on practical execution of thermal R&D activities, including simulation, testing, data analysis, prototype evaluation, and implementation of innovative thermal solutions for next-generation packages such as AI/HPC, chiplet, 2.5D/3D integration, photonics, and power electronics.

Key Responsibilities

1. Thermal Project Execution:  To execute thermal engineering tasks for grant and/or customer-funded R&D projects. To Support project deliverables, timelines, experiments, and reporting. To Perform package thermal assessments and identify hotspot / cooling issues. To Generate technical data, reports, and presentation materials.

2. Thermal Simulation & Analysis: To conduct thermal modelling using tools such as ANSYS Icepak, ANSYS Fluent COMSOL Multiphysics and SIEMENS Flotherm. To perform steady-state and transient thermal simulations, junction temperature prediction and thermal resistance extraction, and thermal design optimization

3. New Cooling Technology Development:  To support development and validation of new cooling concepts, including microchannel cooling, vapor chamber integration, immersion cooling and high-performance TIMs. To build prototypes and conduct proof-of-concept testing.

4. Thermal Characterization & Lab Work: To perform laboratory thermal measurements with IR thermography, thermocouple, thermal transient testing and flow / pressure drop testing. To correlate measured data with simulation results.

5. Cross-functional Collaboration: to work with package design, process integration, materials, and reliability teams. To support customer technical discussions and project reviews. To contribute to publications, patents, and technical proposals.

Requirements

Requirements

• PhD / master’s degree in mechanical engineering, materials science, electrical engineering, microelectronics, thermal sciences and related disciplines.
• 2+ years’ work experience in thermal management for semiconductor packaging preferred.
• Strong background in semiconductor package thermal design, electronics cooling, CFD / thermal modeling, experimental thermal characterization and materials for heat dissipation
• Strong understanding of heat transfer, fluid mechanics, semiconductor packaging flows and AI/HPC package challenges
• Experience in simulation tools and data analytics.
• Familiarity with JEDEC standards is advantageous.
• Strong communication and technical presentation skills.
• Strong industry engagement mindset.
• Collaborative and innovation-driven attitude.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.