Semicon Process Senior/Engineer

Summary

To lead the development, optimization, and stabilization of temporary bonding and debonding (TBDB) processes for advanced packaging applications, ensuring seamless integration with downstream processes and meeting product reliability and quality requirements.

Job

Develop and optimize TBDB processes for various wafer-level packaging applications

Select appropriate materials (e.g., adhesives, carriers) and stabilize related process conditions

Design integrated process flows including wafer thinning, bonding, and debonding

Analyze compatibility with downstream processes and perform process tuning accordingly

Investigate and resolve defect issues such as voids, warpage, and delamination

Coordinate TBDB equipment installation and optimize process parameters

Propose customized process solutions based on customer product and reliability requirements

Supports advanced semiconductor packaging processes requiring TBDB integration

Directly impacts yield stabilization, customer qualification, and new product introduction (NPI)

Plays a key role in cross-process compatibility and back-end process integration

Requirement

Bachelors degree or higher in engineering disciplines such as Materials Science, Mechanical Engineering, Chemical Engineering, Electronics, or Advanced Materials

Minimum 3 years of hands-on experience in TBDB process development

Understanding of material properties for adhesives, carriers, and thermal interface materials

Knowledge of bonding techniques under high temperature and pressure, including heat transfer, stress, and interfacial behaviour

Familiarity with semiconductor back-end or advanced packaging process flows

Strong skills in experiment design, data analysis, and process documentation

Excellent problem-solving and root cause analysis capabilities in process-related issues

Experience in advanced packaging technologies such as 2.5D/3D, TSV, CoWoS, and fan-out

Hands-on experience with TBDB equipment operation

Knowledge of adhesive and laser debonding techniques

Proven experience in cross-process integration and process optimization

Understanding of reliability evaluation and qualification standards

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to [email protected] stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID:

People Profilers Pte Ltd (People Profilers) has entered into a Partnership Recruitment Collaboration with Employment and Employability Institute Pte Ltd (e2i), to extend the support of hiring beyond e2is resources to broaden the reach of jobseekers.

This is in partnership with the Employment and Employability Institute Pte Ltd (e2i).

e2i is the empowering network for workers and employers seeking employment and employability solutions. e2i serves as a bridge between workers and employers, connecting with workers to offer job security through job-matching, career guidance and skills upgrading services, and partnering employers to address their manpower needs through recruitment, training, and job redesign solutions. e2i is a tripartite initiative of the National Trades Union Congress set up to support nation-wide manpower and skills upgrading initiatives. By applying for this role, you consent to People Profilerss PDPA and e2is PDPA (https://www.e2i.com.sg/pdpa/).