Senior Engineer, Process Development, Diffusion, NTI

Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type Participate with Boise TD Films peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions Design and implement advanced process monitoring and control methodologies. Provide advice and counsel to management on significant technical issues. Bachelor's in Materials Science, Chemical/Microelectronic Engineering, or Physics with minimum 5 years of relevant experience Master's, or PhD in Materials Science, Chemical/Microelectronic Engineering, or Physics with minimum 2 years of relevant experience Strong understanding of: - Flow dynamics, thermodynamics, and physical phenomena in deposition - Precursor depletion effects in 3D structures and mitigation strategies - Interface characterization techniques (e.g., SIMS, XPS, EDX, SEM/TEM) - Integration and structural constraints in film deposition processes - Memory process flows, especially for planar and vertical NAND Proficiency in data analysis tools (e.g., Y3) and Design of Experiments (DoE) Proven collaboration skills with local and global teams Excellent communication skills for both in-person and remote interactions Self-motivated, adaptable, and capable of managing multiple projects in a dynamic environment Willingness to travel and stay at Boise TD for extended periods (2-4 months) to support technology development