Senior Engineer, Process Development, Wet, NTI

Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement Prioritize within Singapore based manufacturing Wet Etch team on the key technology issues that need TD breakthroughs. Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement Participate with Boise TD Wet Etch peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions Identify process simplification opportunities and drive cross functional teams in implementation Incorporate best known manufacturing methods into early development phase of upcoming nodes. Design and implement advanced process monitoring and control methodologies. Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers. This position requires communication and collaboration with partners both locally and globally. Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions. Masters/PhD graduates in Materials Science, Chemical/Microelectronic Engineering or Chemistry are welcome to apply. 2-3 years of semiconductor industry experience is preferable A deep understanding of chemistry, chemical kinetics, thermodynamics and mass transport Basic understanding of films and interface engineering and analysis techniques thereof - SIMS, XPS, EDX, SEM/TEM, FTIR. Understanding of various integration and structural impacts and constraints related to wet etch processes. An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular. Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data Working knowledge of Design of Experiments (DoE) Proven ability to collaborate with local and overseas teams on projects Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications. Ability to travel for extended periods of time and stay at Boise TD for 2-4 months at a stretch to work on technology development.