Senior Engineer, Real-Time Defect Analysis (RDA), Equipment Development

Technical Expertise: Capable to provide manual cuts along with building skills for future automated FIB cuts Analytical Skills: Strong data analysis and problem-solving abilities. Equipment Management: Set up equipment, monitor stability, improve capability, and interact with vendor representatives for advanced functionality and application work. Recipe Management: Write or modify equipment recipes to support the needs of the RDA area. Tool Recovery: Perform basic and advanced recoveries of down tools for assigned workstations. Software Upgrades: Drive software upgrades and improvements, working with internal and external vendors for implementation. Tool Monitoring: Monitor tool qualification SPC charts for deviations, initiate tool repairs, and adjust limits as necessary. Data Science skills: Apply scripting, coding, or programming for monitoring performance and capabilities of the inspection data Data Analysis: Collect and analyze tool/process data to suggest ways to improve performance and efficiency. Collaboration: Collaborate with vendors for escalation results on application issues and with Equipment Owners to identify long-term solutions to tool issues. Communication: Excellent verbal and written communication skills for effective vendor and team interactions. Project Management: Ability to manage multiple projects and priorities effectively. Deep technical expertise in Focused Ion Beam (FIB) operations, including advanced cross‑sectioning, milling optimization, and defect characterization Strong proficiency in SEM imaging and interpretation for systematic/random defect identification Experience working with vendors for FIB/SEM equipment setup, troubleshooting, and upgrades >3years Bachelor's or Master's Degree in Electrical Engineering, Chemical Engineering, Materials Science & Engineering, or related field accepted More than 5 years semiconductor manufacturing experience in RDA/inspection recipe setup for defect analysis