Senior Program Manager Advanced Packaging & Technology Development

## Lead all aspects of the full lifecycle of APTD programs, including planning, execution, monitoring, and closure. ## Define program objectives, deliverables, resource plans, and success metrics. ## Lead cross-functional teams across PDE, CPI, DRAM, and NPI to ensure timely, high-quality delivery of critical initiatives. Governance & Operational Excellence ## Develop and implement standardized PMO methodologies, tools, and templates. ## Lead CapEx and OpEx planning, PTM and MOR processes, and integrate BOP design systems. ## Ensure compliance with internal governance standards and external customer requirements. Strategic Alignment & Communication ## Align program goals with APTD's charter to embed analytics and simulation into development workflows. ## Drive team member engagement across BU, PDT, TPM, and central engineering teams. ## Provide leadership with regular updates on program status, risks, and mitigation strategies. ## Bachelor's or Master's degree in Engineering, Materials Science, or related technical field. ## 8+ years of experience in semiconductor packaging, process integration, or technology development. ## Proven record leading complex, cross-functional programs in a high-tech environment. ## Solid understanding of advanced packaging flows (e.g., hybrid bonding, CoWoS, chiplet integration). ## Outstanding communication, leadership, and stakeholder management skills. ## Experience with IIoT hardware deployment and APC systems. ## Familiarity with frameworks such as PDE, CPI, and NPI. ## Knowledge of simulation modeling, yield improvement, and defectivity analysis. ## Define and track critical metrics for program success, yield reporting, and EOL accountability. ## Conduct program reviews to assess outcomes and bring together lessons learned. ## Mentor project managers and foster continuous improvement across PMO practices.