Senior/Principal Engineer, Process Integration, NAND, NTI

Your responsibilities will include, but are not limited to, the following: Improve current process flows and develop innovative solutions to meet product requirements and manufacturability. Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability. Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners. Establish proof of concept for future tech nodes at the manufacturing facility. Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing. Passion in semiconductor technology and innovation Adept at data analysis, problem-solving, and process integration optimization Excellent communication skills and ability to work in cross-functional teams Committed to quality, collaboration, and continuous improvement Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment Ability to travel for extended periods to the US for collaborative R&D work BS, MS/PhD in Electrical Engineering, Microelectronics, CHemical Engineering, Material Science or a related field Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable. Minimum of 3 years of experience in the semiconductor industry in the areas of Process Integration and Yield Enhancement. Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms. In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable. Exposure to R&D and transfer/manufacturing is desirable.