Snr Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM

ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization and coverages by collaboration with Technology Development and Packaging organizations to reduce Manufacturing Line Yield. Cumulative Yield Ownership: Work with cross-functional teams, to lead impactful initiatives that significantly enhance overall cumulative yield and quality improvement, driving substantial benefits for the organization. Provide recommendation to PDE teams for new process conversions to reduce cost, increase yields. Bachelors/Masters of Electrical/Electronic/Mechanical Engineering Degree. Demonstrating Competent Technical Skills , especially in problem solving with root cause understanding and solution space through in depth circuit analysis. Good knowledge of statistics and data analysis tools and scripting. Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs). Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems. Strong sense of responsibility and accountability towards assigned role with professional work ethic. Excellent communication and presentation skills. Passionate about people leadership, with a drive toward ongoing learning and development in this area. Work on site in Singapore with international travel to Taiwan, US, Japan.