Responsibilities for this role will include, but are not limited to, the following: Develop, deploy & support first and second-of-a-kind equipment and processes of Wafer Probers, Testers & Probe Cards Engage equipment suppliers & vendors to address issues of quality, performance, and change management. Establish metrics to drive continuous improvement of equipment performance and processes. Perform statistical analysis of manufacturing data to ensure that processes meet the required quality standards. Participate in Probe equipment solution definition and generate specification requirements that have capability requirements considered for qualification into Probe HVM site deployment. Generate equipment specifications to meet safety and capability requirements of global manufacturing environments. De-bug pre-production probe card issues through in-depth technical analysis identifying root cause and feedback implement corrective solutions to supplier and internal engineering groups. Participate in Probe card design reviews with peers and technical teams. Effectively prepare and present information to Engineering leadership teams. Collaborate with global teams to establish and implement the best-known method probe processes globally. Maintain a strong collaborative relationship with peer groups in other functional areas. Initiate and chair meetings with global manufacturing sites in support of your objectives. Successful candidates for this position will have: Excellent grasp of mechanical and electrical engineering fundamentals. Proficiency in statistics, data analysis, and design of experiments and project management High degree of self-initiative with an ability to think independently. Take initiative, ownership and drive for results across departments. Track record of delivering accurate on-time results. The ability to manage multiple tasks concurrently and see them to a conclusion based on a given timeline. Proficiency in thermal systems, machine design, electro-mechanical controls and components, electrical circuits, materials selection, and mechanical stress analysis. Excellent verbal and written communication and presentation skills. Basic knowledge of 3D CAD software. Ability to read and interpret electrical and mechanical build schematics. Flexibility to accommodate off-shift meetings in other time zones. Working knowledge of semiconductor processes and semiconductor device test methodology A Bachelor of Science degree in Electrical, Mechanical Engineering or similar
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