TECHNOLOGIST - PIE Yield Enhancement

Perform cross-section analysis and Scanning Electron Microscopy (SEM) inspection for process health monitoring. Handle Transmission Electron Microscopy (TEM) sample preparation using Focus Ion Beam (FIB) for TEM inspection. Identify defects and failure mechanism through physical failure analysis using various sample de-processing techniques and wide range of failure analysis equipment. Perform physical fault isolation techniques. Diploma in Electrical/Electronics/Microelectronics/Mechatronics Engineering or any related field. Experience in Real-Time Defect Analysis (RDA) or Failure Analysis related areas will be helpful! Able to work on permanent 12-hour shift.