Intern - APTD SG Wafer Level Technology

Support development of High Bandwidth Memory (HBM) technology through metal plating characterization. Design and follow up on experiments for incumbent and alternative metal plating chemistry characterization. Collaborate with the chemical lab for accurate concentration analysis. Explore plating process parameters and metal stack variations impacts on performance. Develop data-driven recommendations for process optimization. Deliverable Comprehensive analysis report with recommended process targets and validated experimental results. Target to achieve plating coplanarity <1um. Impact of Project Enable robust metal plating processes for next-generation HBM technology. Critical thinking Data analysis Strong problem-solving skills