Intern - HIG HBM Product Engineering

You'll be part of the team that participates in efforts focused on improving key performance indicators such as quality, cost, cycle time, and scalability. Optimized Test Coverage: The responsibility of ensuring optimized test coverage on all current and future HIG HBM design architectures and process nodes is a technical aspect of this role. This is crucial for maintaining the effectiveness and efficiency in high-volume manufacturing. Ensuring that these products are reliable and meet the necessary standards is a technical task that directly impacts the market readiness of the products. Participate in New Product Design Validation: Design verification and in-depth circuit of new products using CAD tools and Verilog simulations. This technical support is crucial for the development of new products and technologies. Yield Improvement and Cost Reduction: The role involves technical tasks like improving manufacturing test yields (Specifically related to Device Issues from the DRAM, Interface and Stacked Die Yield), reducing test time, and resolving yield-related issues. These activities are critical for cost reduction and meeting yield targets. Root Cause and Resolution of Manufacturing Test Flow Issue, Qual and RMA Device Issues Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization. Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions. Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development. Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products. Bachelor's in engineering Available for internship from Jan to May 2026