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For this role, you will drive product quality initiatives during the new product development stage, with a focus on ensuring robust integration of semiconductor manufacturing equipment and maintaining high quality standards. You will collaborate closely with cross-functional teams including process integration, manufacturing, R&D, and suppliers to deliver world-class product reliability and performance.
Key Responsibilities
Lead quality assurance efforts for semiconductor manufacturing equipment, modules and incoming components, including qualification, reliability testing, failure analysis, and yield improvement.
- Oversee and contribute to semiconductor equipment/machine integration projects, ensuring seamless process integration and compliance with quality requirements.
- Drive quality initiatives during new product development (NPD/NPI), from design phase through volume production ramp-up.
- Collaborate with process engineering, fabrication, and integration teams to establish and monitor quality metrics (e.g., SPC, defect reduction, KPI achievement).
- Conduct root cause analysis for quality issues, implement corrective actions, and support customer complaint resolution (e.g., RMA, field returns).
- Collaborate with Field Service Engineers on machine field performance and continuous improvement projects.
- Contribute to cross-functional process improvements.
- Travel to manufacturing sites, suppliers, or customer locations as needed to support integration, audits, or troubleshooting.
Qualifications
- Bachelor's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related field.
- 3+ years of experience in quality engineering within the semiconductor industry.
- Strong quality background, including experience with statistical process control (SPC), 8D/problem-solving methodologies, and Six Sigma practices.
- Proven experience in semiconductor machine/equipment integration (e.g., process tool qualification, integration into fab lines).
- Hands-on experience in new product development/introduction (NPD/NPI), including characterization (CTQ, Critical parameter etc.), qualification (test development, MSA etc.), and transfer to production (Work instructions, SOP, Inspection instruction etc.).
- Willingness and ability to travel domestically and internationally (up to 30% as needed).
- Excellent analytical skills, with proficiency in data analysis tools (e.g., JMP, Minitab) and semiconductor-specific processes.
- Strong communication skills and ability to work collaboratively in a fast-paced environment.
Preferred Skills
- Die bonder usage and operation during high volume manufacturing
- Knowledge of reliability testing, failure analysis, and yield enhancement.
- Certification in quality tools (e.g., Six Sigma Black Belt, APQP).
- Ability to read and write Chinese (both traditional and simplified Character).
- Supplier and/or sub-contractor management experience.
Candidate with less experience will be considered as Engineer, Product Quality.
ASM TECHNOLOGY SINGAPORE PTE LTD
ASM Pacific Technology Ltd. was founded in 1975. We are the world's leading supplier of semiconductor assembly and SMT equipment with a global presence in more than 30 countries. As a Group that achieved US$2.25 billion in revenue in 2017, ASMPT has 11 manufacturing facilities in China, Hong Kong, G...
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